| Title | Thermal Analysis and Testing of Multi Layer Ceramic-Metal Packaged LED |
| Authors | Jin, Peng Zhou, Qifeng Wu, Na Zhong, Qun |
| Affiliation | Peking Univ, Shenzhen Grad Sch, Key Lab Integrated Microsyst, Shenzhen, Peoples R China. |
| Keywords | SYSTEM DYNAMICS MODEL LIGHT-EMITTING-DIODES JUNCTION-TEMPERATURE POWER LUMINAIRE |
| Issue Date | 2009 |
| Citation | 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009).. |
| Abstract | We studied the thermal properties LED light unit composed of nine LED chips in a MLCMP (multi-layer ceramic-metal package) and compared various thermal dynamic models. We concluded that the direct measurement of forward voltage V(f) is the most practical approach for in-situ testing. By calibrating the V(f) to junction temperature T(j) at various forward current in a temperature controlled oven, the linear relationship of V(f) with respect to T(j) was obtained and coefficient beta was accurately extracted from experimental data. |
| URI | http://hdl.handle.net/20.500.11897/406344 |
| Indexed | CPCI-S(ISTP) |
| Appears in Collections: | 深圳研究生院待认领 |
